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Solid-state Battery Market

  • Report Code : NIS 2033
  • 2025-07-18 00:00:00
  • Format : PDF, Excel
  • Pages : 226
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Current NDCs

Current Industry Revenue

2.63 Bn%

2024

Forecasted Industry Revenue

7.52 Bn

2035

CAGR %

15.8%

2025-2035

Report Attribute Details
Target year

2024

Conditionality

No conditionality Available

Gases covered

2025-2035

No conditionality Available

2021-2023

No section_coverd_description Available

(USD Billion)

One-Time / Quarterly / Annual Updates

The Substrate-like PCB Market valued at around USD 7.52 Billion in 2024 and is expected to expand at a CAGR of 15.8% from 2025 to 2035.

Market Dynamics

Surge in Demand for Miniaturized Consumer Electronics

Modern technology enables consumers to want their gadgets including smartphones and wearables and wireless earbuds to have sleek designs and reduced weight and enhanced capabilities. Substrate-like PCBs fulfill modern consumer requirements through their ability to place numerous components into compact spaces while maintaining optimal performance levels. The precise line spacing combined with high layer density of these boards makes them perfect for upcoming advanced electronic devices. The adoption of SLPs by Apple and Samsung flagship devices has initiated a clear trend which drives OEMs and EMS providers to increase their adoption rates for maintaining market competitiveness. The massive consumer demand acts as the primary driving power which pushes the global SLP market toward double-digit expansion.

Advancements in 5G, AI, and IoT Technologies

The deployment of 5G networks worldwide and the expansion of AI and IoT applications drive devices to require enhanced data processing speed and superior signal integrity which SLPs deliver. Multiple AI-powered smartphones along with smart home assistants and edge computing nodes require ultra-reliable high-speed connections that are expanding at a rapid pace. The implementation of substrate-like PCBs allows for more compact circuit layouts and enhanced thermal control which proves essential for high-demand data technologies. SLPs remain a fundamental element for electronic advancement because manufacturers increasingly adopt them to fulfill the performance needs of emerging applications.

Rising Adoption in Automotive Electronics

The automotive industry generates massive potential for SLP market expansion. Modern vehicles feature growing electronic content because they integrate ADAS systems and electric vehicle battery management and entertainment displays. Automotive manufacturers need circuit boards that minimize size yet maintain power-efficient processing and connectivity capabilities within restricted spaces. SLPs deliver optimal performance and compact design features which make them suitable for such operating conditions. SLP suppliers have a chance to build enduring relationships with tier-1 automotive manufacturers through the expanding electric and autonomous vehicle market which drives the mobility revolution.

High Initial Investment and Production Complexity

Manufacturing Substrate-like PCBs presents substantial difficulties although they have beneficial features. The production of these PCBs needs cutting-edge photolithography together with laser drilling and inspection systems which represent substantial capital costs and require expert knowledge. The complex production requirements of these PCBs prevent most small PCB manufacturers from entering the market and restrict their ability to scale production. The exacting tolerances needed for fine-pitch layouts often generate reduced yield rates during initial manufacturing phases. The high production costs together with technical complexities decrease market adoption mainly among companies which focus on cost-effective or small-volume production. The strong market growth of these technologies may experience limitations due to manufacturing process complexities and high costs which need to be resolved for greater adoption.

Key Market Indicators

The following Key Market Indicators present a comprehensive overview of the social and economic landscape of the selected region, offering critical insights into market-specific trends and developments. These indicators, combined with data from government statistics, industry associations, and corporate sources, form the analytical foundation of NextGen Intelligence Stats' market models.

  • Parent Market
  • Dominate Region
  • Dominate End User Industry

Pricing Analysis

Company Market Share Analysis

Market Scope

Aspects Details
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Base Year

2024

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Historic Data

2022-2023

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Forecast Period

2025-2035

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Regions & Countries Covered

North America (United States, Canada, Mexico), Europe (Germany, France, Italy, United Kingdom, Spain, Rest of Europe), Asia Pacific (China, Japan, India, Rest of Asia Pacific), Latin America (Brazil, Argentina, Rest of Latin America), Middle East &

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Companies Profiles

  • Kinsus Interconnect Technology
  • Ibiden
  • Unimicron Technology
  • Samsung Electro‑Mechanics
  • Zhen Ding Technology
  • AT&S
  • TTM Technologies
  • Compeq Manufacturing
  • LG Innotek
  • Tripod Tech

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Segmentation Level Customization

Additional Segments and Sub Segment
Cross-split Segments
Additional Countries with all segments

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Company Level Customization

Market share analysis at country levels
Market tractable revenue
Distributor lists
Quarterly Revenue (Q1,Q2,Q3,Q4)
Forecast revenue
Pricing analysis

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Country level Data Customization

Segmental volume analysis

Pricing Analysis of Product

Company Market Share

Recent Development

With booming worldwide demand particularly from smartphone, wearable, and auto electronics applications industry leaders like Samsung Electro-Mechanics, Zhen Ding, and Unimicron are working hard to increase their SLP production capacity. Upgrading fabrication lines with new mSAP (Modified Semi-Additive Process) and laser drilling technologies to accommodate finer circuit resolution (<25 µm) is a common part of the expansions. These investments not only are growing output but also are growing yield rates and lowering per-unit costs over time. Firms are purposely placing new facilities in Southeast Asia to diversify supply chains, reduce costs, and decrease reliance on Chinese or Taiwanese manufacturing bases.

Another key strategic initiative is developing long-term relationships with OEMs such as Apple, Xiaomi, and Tesla to capture design wins and volume commitment assurances on a regular basis for SLPs. These partnerships enable PCB makers to match manufacturing capabilities with product-specific demands like bespoke trace widths, thermal characteristics, and bendable form factors. By coming on board early in OEM product development cycles, SLP providers better optimize yield and co-develop new products such as multi-layer SLPs or hybrid SLP-packaging solutions. Such partnerships are also used to secure high-margin deals and erect barriers to competition, strengthening the manufacturer's competitive positioning in an intensely competitive market.

Competitive Landscape

Companies in the Substrate-like PCB market are actively seeking product approvals as a means to extend their market reach and ensure their products are accessible in a wider range of regions. This helps improve availability and strengthens their presence across diverse geographical areas. In addition to focusing on approvals, many businesses are adopting expansion strategies to enhance their production and research capabilities. Moreover, some market players are acquiring smaller firms to solidify their market position. This enables them to broaden their product offerings, enhance their expertise, and better meet the growing demands of the market.

•    Kinsus Interconnect Technology
•    Ibiden
•    Unimicron Technology
•    Samsung Electro‑Mechanics
•    Zhen Ding Technology
•    AT&S
•    TTM Technologies
•    Compeq Manufacturing
•    LG Innotek
•    Tripod Technology

Key Questions Answered in the Report

The Substrate-like PCB Market valued at around USD 7.52 Billion in 2024 and is expected to expand at a CAGR of 15.8% from 2025 to 2035.

The Global Substrate-like PCB Market expand at a CAGR of 15.8% from 2025 to 2035. 

Surge in Demand for Miniaturized Consumer Electronics, Advancements in 5G, AI, and IoT Technologies, Rising Adoption in Automotive Electronics, High Initial Investment and Production Complexity

Asia Pacific held largest share accounting for approximately 42.5% of the revenues in 2024. The Asia Pacific region commands, by far, the largest share in the budding Global Substrate-like PCB (SLP) Market, a position that directly illustrates how crucial this area is in world manufacturing for advanced electronics.

  • Kinsus Interconnect Technology, Ibiden, Unimicron Technology, Samsung Electro‑Mechanics, Zhen Ding Technology, AT&S, TTM Technologies, Compeq Manufacturing, LG Innotek, Tripod Tech
Current NDCs

Current Industry Revenue

1.70 Bn%

2024

Forecasted Industry Revenue

4.89 Bn

2035

CAGR %

15.4%

2025-2035

Report Attribute Details
Target year

2024

Conditionality

No conditionality Available

Gases covered

2025-2035

No conditionality Available

2021-2023

No section_coverd_description Available

(USD Billion)

One-Time / Quarterly / Annual Updates

                                       Substrate-like PCB Market Share, By Line/Space Resolution 2024

 

                                           Source: NextGen Intelligence Stats and Consulting LLP

 

Substrate-like PCB Market Analysis by Line/Space Resolution

Based on Line/Space Resolution, the market is segmented into 25/25 & 30/30 µm, < 25/25 µm. The 25/25 & 30/30 µm acquired the largest share of the market with around 65.6% followed by < 25/25 µm. The substantial market portion demonstrates their critical importance for mass-produced consumer electronics including premium smartphones and advanced wearables and compact computing devices. These particular dimensions achieve the best combination of density needed to integrate complex functions with current manufacturing methods at a cost-effective scale for shrinking device footprints.

After the leading segment, the < 25/25 µm category controls the next largest market portion. The latest SLP technology represents the most advanced solution for high-density circuit integration but its adoption rate remains lower than other segments. The high complexity of manufacturing processes and reduced yield rates along with elevated production expenses limit the adoption of ultra-fine line and space fabrication technology. The growing need for small powerful electronic devices will push materials and manufacturing technology development which will increase the market presence of fine-pitch SLPs and make ultra-miniaturization more attainable.

 

Substrate-like PCB Market Analysis by Application

Based on the Application, the market is segmented into Consumer Electronics, Medical, Automotive, Other sectors. The Consumer Electronics dominates the market followed by Automotive. Modern smartphones and wearable technology together with tablets and other compact smart devices drive the essential role of SLPs to achieve better circuit density and better electrical performance in smaller devices. The primary driver of SLP adoption and technological advancement is this segment because of its high volume production cycles and continuous innovation needs.

The next major growth driver for SLP technology exists within the automotive sector. The automotive industry uses SLPs extensively for cutting-edge uses including Advanced Driver-Assistance Systems (ADAS) alongside sophisticated infotainment and electric vehicle (EV) battery management and autonomous driving technologies. The automotive sector requires compact high-performance PCBs that must operate reliably in demanding conditions while processing large data volumes. Modern vehicles demand SLPs as their essential electronic solution because their connectivity and electrification and automation lead to increased component density and complexity. The present and upcoming developments in the global SLP market receive their direction from these two sectors which drive breakthroughs in compact high-performance electronics.

Current NDCs

Current Industry Revenue

XX

XX

Forecasted Industry Revenue

XX

XX

CAGR %

15.7%

2025-2035

Report Attribute Details
Target year

2024

Conditionality

No conditionality Available

Gases covered

2025-2035

No conditionality Available

2021-2023

No section_coverd_description Available

(USD Billion)

One-Time / Quarterly / Annual Updates

42.5% Asia Pacific

Table of Contents

1.1.    Introduction
1.2.    Report Description & Objective
1.3.    Assumption And Limitation

2.1.    Data Collection
2.2.    Primary Research & Secondary Research
2.3.    Bottom-Up Approach & Top-Down Approach
2.4.    Market Analysis & Size Estimation
2.5.    Quality Check & Final Review

3.1.    Report Scope
3.2.    Executive Summary

4.1.    Top Trends To Watch
4.2.    Top Strategies Followed By Key Players
4.3.    Top Investment Pockets

5.1.    Market Definition
5.2.    Market Drivers
5.3.    Market Restraints & Challenges
5.4.    Market Opportunities

6.1.    Porter’s Five Forces’ Analysis
6.2.    Value Chain Analysis / Supply Chain Analysis
6.3.    PESTLE Analysis
6.4.    Regulatory Landscape
6.5.    Pricing Analysis

7.1.    Global Substrate-like PCB Market, By Line/Space Resolution
7.2.   Global Substrate-like PCB Market Attractiveness, By Line/Space Resolution
         7.2.1.    25/25 & 30/30 µm
         7.2.2.    < 25/25 µm

8.1.    Global Substrate-like PCB Market, By Inspection Technology
8.2.   Global Substrate-like PCB Market Attractiveness, By Inspection Technology
         8.2.1.    AOI (Automated Optical Inspection)
         8.2.2.    Direct Imaging

9.1.    Global Substrate-like PCB Market, By Application
9.2.   Global Substrate-like PCB Market Attractiveness, By Application
         9.2.1.    Consumer Electronics
         9.2.2.    Medical
         9.2.3.    Automotive
         9.2.4.    Others

10.1.    Global Substrate-like PCB Market, By Geography
10.2.   Global Substrate-like PCB Market Attractiveness, By Geography
          10.2.1.    North America
          10.2.2.    Europe
          10.2.3.    Asia Pacific
          10.2.4.    Middle East & Africa
          10.2.5.    Latin America

11.1.    North America Market Overview, By Line/Space Resolution
11.2.   North America Market Overview, By Inspection Technology
11.3.   North America Market Overview, By Application
11.4.   North America Market Overview, By Country
         11.4.1.    United States 
         11.4.2.    Canada 

12.1.    Europe Market Overview, By Line/Space Resolution
12.2.   Europe Market Overview, By Inspection Technology
12.3.   Europe Market Overview, By Application
12.4.   Europe Market Overview, By Country
          12.4.1.    Germany 
          12.4.2.    France 
          12.4.3.    UK 
          12.4.4.    Italy 
          12.4.5.    Spain 
          12.4.6.    Rest of Europe 

13.1.    Asia Pacific Market Overview, By Line/Space Resolution
13.2.   Asia Pacific Market Overview, By Inspection Technology
13.3.   Asia Pacific Market Overview, By Application
13.4.   Asia Pacific Market Overview, By Country
          13.4.1.    India 
          13.4.2.    China 
          13.4.3.    Japan 
          13.4.4.    South Korea 
          13.4.5.    Rest of Asia Pacific 

14.1.    Middle East & Africa Market Overview, By Line/Space Resolution
14.2.   Middle East & Africa Market Overview, By Inspection Technology
14.3.   Middle East & Africa Market Overview, By Application
14.4.   Middle East & Africa Market Overview, By Country
          14.4.1.    GCC 
          14.4.2.    South Africa 
          14.4.3.    Rest of Middle East & Africa 

15.1.    Latin America Market Overview, By Line/Space Resolution
15.2.   Latin America Market Overview, By Inspection Technology
15.3.   Latin America Market Overview, By Application
15.4.   Latin America Market Overview, By Country
          15.4.1.    Brazil 
          15.4.2.    Argentina 
          15.4.3.    Rest of Latin America

16.1.    Key Developments
          16.1.1.    Partnerships, Collaborations, Agreements
          16.1.2.    Mergers & Acquisitions
          16.1.3.    New Product Developments
          16.1.4.    Other Developments
16.2.    Company Share Analysis
16.3.    Company Profiles
          16.3.1.    Kinsus Interconnect Technology
                        16.3.1.1.    Company Overview
                        16.3.1.2.    Product Overview
                        16.3.1.3.    Financial Insights
                        16.3.1.4.    Recent Developments
                        16.3.1.5.    SWOT Analysis

          16.3.2.    Ibiden
          16.3.3.    Unimicron Technology
          16.3.4.    Samsung Electro‑Mechanics
          16.3.5.    Zhen Ding Technology
          16.3.6.    AT&S
          16.3.7.    TTM Technologies
          16.3.8.    Compeq Manufacturing
          16.3.9.    LG Innotek
          16.3.10.    Tripod Technology
          16.3.11.    Other Key Players

Research Methodology

Data Collection
Primary Research & Secondary Research
Bottom-Up Approach & Top-Down Approach
Market Analysis & Size Estimation
Quality Check & Final Review

Market segmentation

By Line/Space Resolution
•    25/25 & 30/30 µm
•    < 25/25 µm 
By Line/Space Resolution
•    AOI (Automated Optical Inspection)
•    Direct Imaging
By Application
•    Consumer Electronics
•    Medical
•    Automotive
•    Others